The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Dec. 11, 2015
Applicant:

National Chung-shan Institute of Science & Technology, Taoyuan, TW;

Inventors:

Cheng Lin, Hsinchu, TW;

Jing-Hong Chen, Taoyuan, TW;

Tsung-Yeh Liu, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/08 (2006.01); F28F 9/02 (2006.01); H01L 23/473 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28F 13/08 (2013.01); F28F 9/026 (2013.01); H01L 23/473 (2013.01); F28D 2021/0029 (2013.01); F28F 2260/02 (2013.01);
Abstract

The present invention mainly provides a novel microchannel structure comprising a plurality of first fluid-guiding channels, a plurality of micro fluid-guiding channels and a plurality of second fluid-guiding channels. Particularly, the first fluid-guiding channel has an arc-shaped fluid-guiding end corner communicating with a first channel opening of the micro fluid-guiding channel, and the second fluid-guiding channel has an arc-shaped fluid-guiding start corner communicating with a second channel opening of the micro fluid-guiding channel. Therefore, when a refrigerant fluid flows in the heat sink, the flow speed of the refrigerant fluid would be changed because the cross sectional area of an U-shaped fluid-guiding channel constructed by the arc-shaped fluid-guiding end corner, the micro fluid-guiding channel and the arc-shaped fluid-guiding start corner varies along the flow direction of the refrigerant fluid, such that the heat dissipating ability of the heat sink is enhanced without increasing the power of circulation pump.


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