This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Cooler Master Corp.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Tsung-Wei Lin and Liquid Cooling Innovation.
Introduction
Tsung-Wei Lin is an inventor based in Taipei, Taiwan, associated with Cooler Master Corp. His work includes a patent for a liquid-cooling heat exchange casing designed to circulate coolant through a computer cooling system.
Latest Patents
Lin’s listed patent, “Liquid Cooling Heat Exchange Casing,” describes a chassis with inlet and outlet coolant passageways, adapters, and at least one radiator. Coolant flows from the inlet opening through the inlet passageway and radiator, then through the outlet passageway to the outlet opening, where it can be circulated again. Lin is credited with 1 patent.
Career Highlights
The available information identifies Lin’s work with Cooler Master Corp. and highlights his patented approach to integrating radiator connections and coolant flow paths within a casing.
Collaborations
Lin’s listed coworkers include Shui-Fa Tsai and Chien-Liang Lin. The provided information does not specify their roles in the patent or the extent of their collaboration.
Conclusion
Tsung-Wei Lin’s patent presents a casing-based liquid-cooling design that organizes coolant circulation through connected passageways and a radiator.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile