Taipei City, Taiwan

Tsung Wei Lin

This inventor holds 1 USPTO granted patent. Top assignee: Cooler Master Corp.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung Wei Lin. Retrieved from https://idiyas.com/inventor/tsung-wei-lin-14jgrg8d

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tsung Wei Lin and His Cooling Apparatus Invention.

Introduction

Tsung Wei Lin is an inventor associated with Taipei City, Taiwan, and Cooler Master Corp. His work includes a patent for a cooling apparatus designed with two heat exchange units and separate pumping units.

Latest Patents

Lin’s listed patent is titled “Cooling apparatus.” It describes a base plate with two heat exchange units and a recess between them. A cover couples to the base plate, enclosing both units within a heat exchange chamber. The cover has two sets of openings, each positioned above one of the heat exchange units, with a pumping unit mounted over each set. The design brings together the heat exchange units and their corresponding pumping units in a single apparatus.

Lin is credited with 1 patent in the information provided.

Career Highlights

Lin’s listed invention focuses on cooling-system structure and the arrangement of heat exchange and pumping components. The available information identifies Cooler Master Corp. as his company.

Collaborations

Shui Fa Tsai is identified as Lin’s coworker. The information provided does not specify whether Tsai collaborated on the cooling apparatus patent.

Conclusion

Tsung Wei Lin’s listed patent presents a cooling apparatus that combines two heat exchange units with separately positioned pumping units, reflecting his documented contribution to cooling technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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