Tsung-Po Lee

Title: Tsung-Po Lee: Innovator in Wafer Probing Technology

Introduction

Tsung-Po Lee is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor testing, particularly through his innovative approaches to wafer probing systems. His work is characterized by a focus on enhancing the efficiency and longevity of testing equipment.

Latest Patents

One of Tsung-Po Lee's key inventions is a patent for a probing system for discrete wafers. This invention introduces a unique probing system that utilizes a suction nozzle to securely hold a wafer during testing. The design allows for the adjustment of the relative distance between the suction nozzle and the probes, optimizing the conditions of the probing system. This innovation not only improves the accuracy of testing but also extends the usage life of the equipment. Tsung-Po Lee holds 1 patent related to this technology.

Career Highlights

Tsung-Po Lee is currently employed at Hermes Testing Solutions Inc., where he continues to develop and refine testing technologies. His work at the company has positioned him as a key player in advancing semiconductor testing methodologies. His expertise and innovative spirit have contributed to the company's reputation for excellence in the industry.

Collaborations

Throughout his career, Tsung-Po Lee has collaborated with talented individuals such as Wen-Yuan Hsu and Chi-Ming Yang. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

In summary, Tsung-Po Lee is a distinguished inventor whose work in wafer probing technology has made a significant impact on the semiconductor industry. His innovative solutions and collaborative efforts continue to drive advancements in testing methodologies.