New Taipei, Taiwan

Tsung-Ping Tien

This inventor holds 1 USPTO granted patent. Top assignee: Kinpo Electronics, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Ping Tien. Retrieved from https://idiyas.com/inventor/tsung-ping-tien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tsung-Ping Tien and His Curved-Surface Button Invention.

Introduction

Tsung-Ping Tien is an inventor based in New Taipei, Taiwan. His work includes a patented button structure designed to improve the positioning and movement of a button assembly.

Latest Patents

Tien is associated with 1 patent, titled “Curved-Surface Button Structure.” The invention includes a housing with a curved surface and through hole, a button with a driven part, and a button assembly comprising a pressing plate, installation seat, and extending column. A positioning sleeve fits around the extending column and is larger than the button’s driven part. When the assembly is pressed, the column contacts the driven part while the sleeve surrounds it, helping guide the assembly’s movement and reduce the risk of sticking or slipping out of position.

Career Highlights

Tien is associated with Kinpo Electronics, Inc. His patented design addresses a practical mechanical challenge: maintaining reliable button movement within a curved-surface housing.

Collaborations

The available information connects Tien’s invention with Kinpo Electronics, Inc. It does not specify additional collaborators.

Conclusion

Tsung-Ping Tien’s curved-surface button structure uses a positioning sleeve to help guide button movement and prevent misalignment, reflecting his contribution to product design at Kinpo Electronics, Inc.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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