Tsung-Lin Hsieh

Title: Innovations of Tsung-Lin Hsieh in Microelectromechanical Systems

Introduction

Tsung-Lin Hsieh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS). With a total of two patents to his name, Hsieh's work focuses on enhancing the functionality and reliability of MEMS devices.

Latest Patents

Hsieh's latest patents include a wire-bond damper for shock absorption. This innovation is directed towards a MEMS package that comprises a wire-bond damper. The design features a housing structure that overlies a support substrate, with a MEMS structure positioned between them. The MEMS structure includes an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass, allowing for movement within a cavity. The wire-bond damper is strategically placed on the movable mass or the surrounding structure, effectively dampening shock to the movable mass.

Career Highlights

Tsung-Lin Hsieh is currently employed at Taiwan Semiconductor Manufacturing Company Limited. His work at this leading semiconductor manufacturer has allowed him to apply his innovative ideas in practical applications. Hsieh's contributions to MEMS technology have positioned him as a key figure in the industry.

Collaborations

Hsieh has collaborated with notable coworkers such as Wei-Jhih Mao and Shang-Ying Tsai. These collaborations have further enriched his work and contributed to advancements in MEMS technology.

Conclusion

Tsung-Lin Hsieh's innovations in microelectromechanical systems demonstrate his commitment to advancing technology in this field. His patents reflect a deep understanding of the complexities involved in MEMS design and functionality.