Taichung, Taiwan

Tsung-Ju Hsu

This inventor holds 2 USPTO granted patents. Top assignee: Benq Materials Corporation. Active years: 2014-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Ju Hsu. Retrieved from https://idiyas.com/inventor/tsung-ju-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2014-2015

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2 patents (USPTO):Explore Patents

Title: Tsung-Ju Hsu: Innovator in Adhesive and Nano Silver Technologies

Introduction

Tsung-Ju Hsu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the fields of adhesive compositions and nano silver particle preparation. With a total of 2 patents, his work showcases innovative solutions for modern technological challenges.

Latest Patents

One of his latest patents is an adhesive composition designed for conduction between electrical elements. This invention comprises 25 to 46 parts by weight of nitrile-butadiene rubber with a Mooney viscosity ranging from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, and 16 to 32 parts by weight of thermoplastic resin. The thermoplastic resin is selected from a group that includes phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer, and Novolak resin. Additionally, the composition includes two organic peroxides with different one-minute half-life temperatures and a coupling agent.

Another significant patent by Hsu is a method for preparing nano silver particles. This method involves mixing polyvinyl pyrrolidone (PVP) and silver nitrate (AgNO) in a solvent to create a reactive solution. The solution is then heated to a temperature below the boiling point of the solvent to facilitate the formation of nano silver particles. An accelerating agent is added during the reaction, and the process is terminated when the particles reach a diameter of approximately 50 nm to 120 nm.

Career Highlights

Tsung-Ju Hsu is currently associated with Benq Materials Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the applications of adhesives and nano materials in various industries.

Collaborations

Hsu collaborates with talented individuals such as Kai-Hsuan Chang and An-Ting Kuo, contributing to a dynamic and innovative work environment.

Conclusion

Tsung-Ju Hsu's contributions to adhesive technology and nano silver particle preparation highlight his role as a leading inventor in his field. His patents reflect a commitment to innovation and excellence in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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