Company Filing History:
1 out of 242 
1 out of 1 Years Active: 2007
Title: Tsugio Nakata: Innovator in Plastic Bonding Technology
Introduction
Tsugio Nakata is a notable inventor based in Ibaraki-ken, Japan. He has made significant contributions to the field of plastic bonding technology, particularly through his innovative patent.
Latest Patents
Nakata holds a patent titled "Structure of bonding plastic part insert-molded with wiring board and method of bonding the same." This invention involves a method for insert-molding a wiring board, where a hole side projected portion is designed to contact a bonding face of another plastic part. The bonding of the two plastic parts is achieved by melting the projected portion using ultrasonic waves, ensuring a strong and reliable connection.
Career Highlights
Throughout his career, Tsugio Nakata has worked with reputable companies, including Ohi Seisakusho Co., Ltd. and Jonan Industrial Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in plastic bonding technologies.
Collaborations
Nakata has collaborated with several professionals in his field, including Haruo Mochida and Shingo Goto. These partnerships have fostered innovation and development in his projects.
Conclusion
Tsugio Nakata's work in plastic bonding technology exemplifies the impact of innovative thinking in engineering. His patent and career achievements highlight his dedication to advancing manufacturing processes.