The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2007
Filed:
Sep. 12, 2003
Haruo Mochida, Kanagawa, JP;
Shingo Goto, Kanagawa, JP;
Masakazu Akahori, Kanagawa, JP;
Yoshio Itabashi, Ibaraki-ken, JP;
Katsumi Uraguchi, Ibaraki-ken, JP;
Tsugio Nakata, Ibaraki-ken, JP;
Haruo Mochida, Kanagawa, JP;
Shingo Goto, Kanagawa, JP;
Masakazu Akahori, Kanagawa, JP;
Yoshio Itabashi, Ibaraki-ken, JP;
Katsumi Uraguchi, Ibaraki-ken, JP;
Tsugio Nakata, Ibaraki-ken, JP;
OHI Seisakusho Co., Ltd., Yokohama, JP;
Jonan Industrial Co., Ltd., Inashiki, JP;
Abstract
In insert-molding a wiring board, at either one of a surrounding of a holding hole of the wiring board provided at a first plastic part and a second plastic part opposed thereto, a hole side projected portion capable of being brought into contact with a bonding face of other thereof is provided, and the surrounding of the holding hole in the first plastic part and the second plastic part are bonded to each other by melting the hole side projected portion by applying ultrasonic wave to bonding portions of the two plastic parts.