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For the Inventor, By the Inventor

Dongguan, China

Tseng-Feng Wen

This inventor holds 16 USPTO granted patents. Top assignee: Transound Electronics Co., Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tseng-Feng Wen. Retrieved from https://idiyas.com/inventor/tseng-feng-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16

% Patents Active = 81.3

Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 47(Granted Patents)


Company Filing History:

goldMedal16 out of 22 
 
Transound Electronics Co., Ltd.
 patents

Years Active: 2016-2025

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16 patents (USPTO):Explore Patents
1. 12317039 - Bone conduction receiver (2025-05-27),
2. 12143794 - Loudspeaker using semiconductor voice coil and electronic device using the same (2024-11-12),
3. D1010610 - Headset (2024-01-09),
4. 11778388 - Speaker (2023-10-03),
5. 11503394 - TWS bone conduction earphone (2022-11-15),
6. 11451892 - One-piece speaker having built-in sound cavity (2022-09-20),
7. 11297436 - Solid-medium sound conducting receiver and electronic device with the same (2022-04-05),
8. 10887681 - Combination of bone conduction Bluetooth earphone and charging base (2021-01-05),
9. 10873815 - Electret condenser microphone with low noise figure and method for producing the same (2020-12-22),
10. 10715905 - Noise cancelling earphone integrated with filter module (2020-07-14),
11. 10638211 - In-ear headphone having MMCX socket and detachable in-ear headphone assembly (2020-04-28),
12. 10250966 - Electrostatic loudspeaker and electrostatic headphone (2019-04-02),
13. 9860647 - High sound quality piezoelectric speaker (2018-01-02),
14. 9686603 - Freely adjustable ergonomic bone conduction earphone rack (2017-06-20),
15. 9510102 - Moving iron sounding device (2016-11-29),

Title: The Innovative Contributions of Tseng-Feng Wen

Introduction

Tseng-Feng Wen is a distinguished inventor based in Dongguan, China, renowned for his significant contributions to the field of electronics. With an impressive portfolio of 15 patents, his work primarily revolves around advancements in audio technology.

Latest Patents

Among his latest innovations is a patent for a loudspeaker that employs a semiconductor voice coil. This design features a vibrating assembly alongside a magnetic force assembly, which are strategically arranged apart. The vibrating component encompasses a diaphragm and the semiconductor voice coil, positioned on one side of the diaphragm. Interestingly, the magnetic force assembly and the semiconductor voice coil are situated on the same side of the diaphragm, creating a magnetic gap within the magnetic force assembly. This innovative arrangement ensures that the magnetic field lines in the magnetic gap are perpendicular to the current direction in the semiconductor voice coil, enhancing audio performance. Additionally, his patent also includes an electronic device that incorporates this advanced loudspeaker technology.

Career Highlights

Currently, Tseng-Feng Wen is affiliated with Transound Electronics Co., Ltd., a key player in the electronics industry. Throughout his career, he has dedicated himself to pushing technological boundaries and enhancing sound quality through innovative engineering solutions.

Collaborations

Throughout his journey, Tseng-Feng Wen has collaborated with notable coworkers, including Huming Zheng and Hui Xue. Together, they have driven advancements in audio technologies and have contributed to the exciting developments at Transound Electronics Co., Ltd.

Conclusion

Tseng-Feng Wen's contributions to the field of electronics, particularly in loudspeaker technology, showcase his inventive spirit and commitment to innovation. With 15 patents to his name, he continues to inspire future generations of inventors and engineers, paving the way for continued advancements in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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