Tse-Hsien Wu

Title: Tse-Hsien Wu: Innovator in Semiconductor Technology

Introduction

Tse-Hsien Wu is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to through silicon vias.

Latest Patents

Wu holds a patent for a method of manufacturing a through silicon via (TSV). This patent outlines a process that includes forming a TSV sacrificial structure in a substrate, which contacts a metal interconnect on the front side of the substrate. The method further involves performing a backside thinning process to expose the TSV sacrificial structure from the back side of the substrate, removing the TSV sacrificial structure to create a through silicon hole, and filling this hole with conductive material to form a TSV.

Career Highlights

Tse-Hsien Wu is associated with Powerchip Semiconductor Manufacturing Corporation, where he applies his expertise in semiconductor manufacturing. His work has been instrumental in advancing the efficiency and effectiveness of TSV technology.

Collaborations

Some of his notable coworkers include Shih-Ping Lee and Pin-Chieh Huang, who contribute to the innovative environment at Powerchip Semiconductor Manufacturing Corporation.

Conclusion

Tse-Hsien Wu's contributions to semiconductor technology, particularly through his patent on through silicon vias, highlight his role as an influential inventor in the industry. His work continues to impact the field significantly.