This inventor holds 1 USPTO granted patent. Top assignee: Pegatron Corporation. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Tse-Hao Yang: Innovator in Connector Technology
Introduction
Tse-Hao Yang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of connector technology, particularly through his innovative designs and manufacturing methods.
Latest Patents
Tse-Hao Yang holds a patent for a connector and its manufacturing method. This invention provides a connector designed to be mounted on a circuit board that includes a mounting hole. The connector features a guide pin module and a conductive cover. The guide pin module is positioned on one side of the circuit board and consists of a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole that corresponds to the mounting hole. The metal guide pin is inserted into both the perforation hole and the mounting hole. The glass sealing layer is placed at the perforation hole, wrapping around part of the metal guide pin. The conductive cover is attached to the mounting hole, connects to the top of the metal guide pin, and extends from the circuit board. This conductive cover is soldered to the circuit board, establishing an electrical connection between the metal guide pin and the circuit board.
Career Highlights
Tse-Hao Yang is currently employed at Pegatron Corporation, where he continues to develop innovative technologies. His work has been instrumental in advancing connector designs that enhance the functionality and reliability of electronic devices.
Collaborations
Throughout his career, Tse-Hao Yang has collaborated with talented individuals such as Kai-Wen Lee and Yen-Yen Chiu. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Tse-Hao Yang is a distinguished inventor whose work in connector technology has made a significant impact in the field. His innovative designs and collaborative efforts continue to drive advancements in electronic connectivity.
