Taipei, Taiwan

Tsai-Hui Chien

This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Molex Corporation. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsai-Hui Chien. Retrieved from https://idiyas.com/inventor/tsai-hui-chien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2026

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2 patents (USPTO):Explore Patents

Title: Tsai-Hui Chien: Innovator in Connector Assembly Technology

Introduction

Tsai-Hui Chien is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of connector assembly technology. With a total of 2 patents to his name, his work showcases innovation and practicality in design.

Latest Patents

Tsai-Hui Chien's latest patents include a connector assembly that features a shielding cage, a light guiding pipe, and a base. This assembly is designed to facilitate the secure connection of light guiding components. Another patent he holds is for a connector assembly that comprises a cage and a heat sink. This design incorporates latching plates with guiding and latching portions, enhancing the assembly process and ensuring a reliable connection.

Career Highlights

Tsai-Hui Chien is currently employed at Molex Corporation, a leading company in the field of electronic components. His work at Molex has allowed him to develop innovative solutions that address the needs of modern technology.

Collaborations

Some of his coworkers include Sheng-Ping Yen and Vinayakumar Kori, who contribute to the collaborative environment at Molex Corporation.

Conclusion

Tsai-Hui Chien's contributions to connector assembly technology reflect his dedication to innovation and excellence. His patents demonstrate a commitment to improving the functionality and reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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