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For the Inventor, By the Inventor

Winona Lake, IN, United States of America

Troy W Hershberger

This inventor holds 56 USPTO granted patents and 11 published patent applications and 10 EPO patents, primarily in Orthopedic Devices (CPC class A61F). Top assignees: Biomet Manufacturing Corporation, Biomet, Inc., Bioresearch, Inc.. Active years: 1995-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Troy W Hershberger. Retrieved from https://idiyas.com/inventor/troy-w-hershberger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 56 

% Patents Active = 73.2

 

Average Co-Inventor Count = 2.0

ph-index = 23

Forward Citations = 3,314(Granted Patents)

Forward Citations (Not Self Cited) = 3,207(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Warsaw, IN (US) (1995 - 2009)
  • Winona Lake, IN (US) (2002 - 2022)

Company Filing History:

goldMedal44 out of 813 
 
Biomet Manufacturing Corporation
 patents
silverMedal9 out of 119 
 
Biomet, Inc.
 patents
bronzeMedal1 out of 108 
 
Bioresearch, Inc.
 patents
4. 1 out of 1 
 
Blomet Manufacturing, LLC
 patent
5. 1 out of 834,513 
Other
 patents

Years Active: 1995-2024

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Areas of Expertise:
Transdermal Devices
Patient-Specific Guides
Modular Prosthetics
Hip Joint Devices
Mechanical Axis Alignment
Bone-Cutting Instruments
Multi-Bearing Prosthesis
Porous Implants
Adjustable Augments
Minimally Invasive Surgery
Cobalt Bearing Surface
Latent Mobile Bearing
56 patents (USPTO):Explore Patents
1. 12096989 - Plan implementation (2024-09-24),
2. 11443846 - Integrated orthopedic planning and management process (2022-09-13),
3. 11191549 - Tangential fit of patient-specific guides (2021-12-07),
4. 11160611 - Plan implementation (2021-11-02),
5. 10857010 - Modular transdermal compress device (2020-12-08),
6. 10835392 - Transdermal intraosseous device (2020-11-17),
7. 10426491 - Tangential fit of patient-specific guides (2019-10-01),
8. 10327922 - Modular transdermal compress device (2019-06-25),
9. 10166125 - Transdermal intraosseous device (2019-01-01),
10. 9949848 - Transdermal intraosseous device (2018-04-24),
11. 9931168 - Plan implementation (2018-04-03),
12. 9844451 - Modular transdermal compress device (2017-12-19),
13. 9826981 - Tangential fit of patient-specific guides (2017-11-28),
14. 9730616 - Mechanical axis alignment using MRI imaging (2017-08-15),
15. 9668747 - Patient-specific-bone-cutting guidance instruments and methods (2017-06-06),

Title: The Innovative Journey of Troy W Hershberger

Introduction:

Troy W Hershberger, a talented inventor hailing from Winona Lake, IN (US), has made significant contributions to the world of innovation with his creative mind and dedication to problem-solving.

Latest Patents:

Troy W Hershberger holds several patents in various fields, including technology, engineering, and design. His latest patents focus on improving efficiency in renewable energy systems and enhancing user experience in consumer electronics.

Career Highlights:

Throughout his career, Troy W Hershberger has worked tirelessly to bring his ideas to life. His innovative solutions have garnered recognition in the industry, earning him a reputation as a forward-thinker and a pioneer in his field.

Collaborations:

Troy W Hershberger has collaborated with leading companies and research institutions to further develop his inventions. His ability to work effectively in a team setting has led to successful partnerships and groundbreaking innovations.

Conclusion:

In conclusion, Troy W Hershberger's passion for innovation and his commitment to pushing the boundaries of what is possible have established him as a respected inventor in Winona Lake, IN (US) and beyond. His contributions to the world of technology continue to inspire and drive progress in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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