Hawthorne, CA, United States of America

Troy A Conwell

This inventor holds 1 USPTO granted patent. Top assignee: Hughes Electronics Corporation. Active years: 1999.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 47(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Troy A. Conwell: Innovator in Composite Heat Sink Technology

Introduction

Troy A. Conwell is a notable inventor based in Hawthorne, CA (US). He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on composite materials and their applications in heat dissipation technologies.

Latest Patents

Troy A. Conwell holds 1 patent for his invention titled "Composite heat sink/support structure." This patent describes a heat sink board structure that includes a thermal/structural base featuring a composite core layer made of graphitized carbon fibers infiltrated with a first resin material matrix. The design emphasizes the unidirectional orientation of the carbon fibers, which are aligned parallel to the face of the composite core layer. Additionally, transverse reinforcement layers are bonded to the opposite faces of the composite core layer, enhancing its structural integrity.

Career Highlights

Conwell is associated with Hughes Electronics Corporation, where he has applied his expertise in composite materials to develop advanced thermal management solutions. His innovative approach has positioned him as a key player in the field of electronics cooling.

Collaborations

Throughout his career, Troy has collaborated with notable colleagues, including Dennis Quan and Roderick A. Bulante. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Troy A. Conwell's contributions to composite heat sink technology exemplify the importance of innovation in thermal management. His work continues to influence the industry and pave the way for future advancements in heat dissipation solutions.

Profile summary based on public USPTO records.
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