This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: The Innovative Journey of Inventor Trevor Liu
Introduction: Trevor Liu, a talented inventor based in Chung Ho, Taiwan, is making significant contributions to the field of electronic devices. His work is exemplified by his unique approach to packaging integrated circuits, showcasing his inventive spirit and commitment to innovation.
Latest Patents: Trevor Liu holds a patent for a groundbreaking invention titled "Delamination resistant packaged die having support and shaped die having protruding lip on support." This patent presents an innovative packaged electronic device that features a thickness-shaped IC die with a distinctive design. The design includes a top portion, top surface, active circuitry, bottom portion, and bottom surface. Notably, the device's bottom surface area is at least 5% smaller than the top surface area, which results in a protruding lip with a bottom lip surface. This inventive configuration enhances the mechanical stability and performance of the packaged electronic devices, addressing critical challenges in the industry.
Career Highlights: Trevor Liu is currently employed at Texas Instruments Corporation, a leading company in the development of semiconductor technology. His role at the company has allowed him to apply his knowledge and skills in creating advanced electronic solutions. With one patent to his name, Trevor's inventive contributions demonstrate his expertise and forward-thinking approach within the competitive landscape of technology development.
Collaborations: Trevor has had the opportunity to collaborate with fellow innovators, including Chien-Te Feng and Kazuaki Ano. Their collective efforts in research and development have contributed to the advancement of electronic packaging solutions, showcasing the power of teamwork in driving innovation.
Conclusion: As an inventor, Trevor Liu is making strides in the electronics industry with his innovative patent on delamination-resistant packaged dies. His work at Texas Instruments Corporation along with fellow collaborators reflects a strong commitment to advancing technology. Trevor's achievements not only highlight his skills as an inventor but also underscore the importance of research and collaboration in fostering innovation within the ever-evolving landscape of electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
