Chapel Hill, NC, United States of America

Trevor Hackman

This inventor holds 1 USPTO granted patent. Top assignee: The University of North Carolina at Chapel Hill. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Trevor Hackman. Retrieved from https://idiyas.com/inventor/trevor-hackman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Trevor Hackman and the Transoral Robotic Simulator

Introduction

Trevor Hackman is an inventor associated with the University of North Carolina at Chapel Hill. His patent work includes a simulator designed to support training in transoral robotic surgery.

Latest Patents

Hackman is credited with 1 patent: “Transoral Robotic Simulator.” The invention describes a three-dimensional human head model with an oral cavity made from synthetic material, including a mandible structure and a simulated tongue and/or tonsil made from silicone. Artificial tissue is placed inside the oral cavity to mimic biological tissue, such as a tumor. Marker material on or within the artificial tissue helps users distinguish it visually from the surrounding synthetic material.

Career Highlights

The simulator provides a physical model for practicing transoral robotic surgery techniques. Its combination of anatomical structures, simulated tissue, and visual markers is intended to make the training experience more realistic and useful.

Collaborations

Hackman’s listed coworkers include Alex Murr and Richard Harry Feins. His work is associated with the University of North Carolina at Chapel Hill.

Conclusion

Trevor Hackman’s patented simulator combines modeled oral anatomy and distinguishable artificial tissue to support transoral robotic surgery training.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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