Ashland, MA, United States of America

Trebor Heminway


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Trebor Heminway: Innovator in Laser Solder Technology

Introduction

Trebor Heminway, an inventive mind located in Ashland, MA, has made a significant contribution to the field of laser soldering with his innovative patent. His focus on creating advanced solutions in optical fiber attachment has provided new possibilities for various electronic applications.

Latest Patents

Heminway holds a patent for a unique solder preform designed specifically for low heat stress laser solder attachment. This inventive solder preform features a body covered with solder on its bottom surface, incorporating a groove that extends along the first face from one end to the other. This groove is wider than the diameter of the optical fiber, ensuring easy and unimpeded alignment when attaching the optical fiber to a fiber attach pad. Moreover, the geometric shape of the body can vary, including forms such as a rectangular box, a cube, a cylinder, and other geometric shapes with flat surfaces and grooves.

Career Highlights

Trebor Heminway is currently associated with Matsushita Electric Industrial Co., Ltd., where he applies his expertise in developing cutting-edge technologies. His work focuses on innovations that enhance performance and reliability in electronic components.

Collaborations

Throughout his career, Heminway has collaborated with talented professionals, including his coworkers Brian Massey and Michael J Powers. Their combined efforts contribute significantly to the innovative environment at Matsushita Electric, fostering advancements in technology.

Conclusion

Trebor Heminway has established himself as a notable inventor in the realm of laser solder attachment technology. His patent not only demonstrates his inventive capabilities but also advances the industry by providing practical solutions for the efficient joining of optical fibers. As he continues to innovate, his contributions will undoubtedly shape the future of electronic manufacturing.

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