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For the Inventor, By the Inventor

Sakui, Japan

Toyoaki Tanaka

This inventor holds 5 USPTO granted patents. Top assignee: Tdk Corporation. Active years: 1997-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toyoaki Tanaka. Retrieved from https://idiyas.com/inventor/toyoaki-tanaka-pg9rmwi9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 35(Granted Patents)


Location History:

  • Saku, JP (1997 - 2001)
  • Sakui, JP (2001)
  • Nagano, JP (2000 - 2003)

Company Filing History:

goldMedal5 out of 8,271 
 
Tdk Corporation
 patents

Years Active: 1997-2003

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5 patents (USPTO):Explore Patents
1. 6554976 - Electroplating apparatus (2003-04-29),
2. 6184613 - Electrode assembly, cathode device and plating apparatus including a gap configured to eliminate a concentration of a line of electrical force at a boundary between a cathode and plate forming surface of an object (2001-02-06),
3. 6181057 - Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member (2001-01-30),
4. 6090260 - Electroplating method (2000-07-18),
5. 5700381 - Method for manufacturing thin film magnetic head (1997-12-23),

Title: Toyoaki Tanaka: Innovator in Electroplating Technology

Introduction

Toyoaki Tanaka is a prominent inventor based in Sakui, Japan. He has made significant contributions to the field of electroplating, holding a total of 5 patents. His innovative approaches have advanced the technology used in plating processes, making them more efficient and effective.

Latest Patents

One of Tanaka's latest patents is an electroplating apparatus that introduces a method of electroplating an object while ensuring that it maintains cathode potential during the process. This method involves draining used plating solution and supplying new plating solution for each plating procedure. Additionally, he has developed an electrode assembly and cathode device that includes a gap designed to eliminate concentration of electrical force at the boundary between the cathode and the surface of the object being plated.

Career Highlights

Toyoaki Tanaka is associated with TDK Corporation, where he has been instrumental in developing advanced electroplating technologies. His work has not only enhanced the efficiency of plating processes but has also contributed to the overall advancement of manufacturing techniques in the industry.

Collaborations

Tanaka has collaborated with notable colleagues such as Satoshi Inoue and Yoshiro Nakagawa. These partnerships have fostered innovation and have led to the successful development of new technologies in the field of electroplating.

Conclusion

Toyoaki Tanaka's contributions to electroplating technology exemplify his dedication to innovation and excellence. His patents and collaborations continue to influence the industry, showcasing the importance of research and development in advancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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