Company Filing History:
Years Active: 1994
Title: Toshiyuki Chida: Innovator in Adhesive Technology
Introduction
Toshiyuki Chida is a notable inventor based in Naka, Japan. He has made significant contributions to the field of adhesive technology, particularly in applications related to printed circuit boards. His innovative approach has led to the development of a unique adhesive agent that enhances the performance and reliability of electronic components.
Latest Patents
Toshiyuki Chida holds a patent for an adhesive agent designed for the substrate of electroless plating. This adhesive agent is characterized by its composition, which includes epoxy resin, synthetic rubber, and phenolic resin as the main components. It also features a hardener for the epoxy resin, an inorganic filler with hydroxyl groups, and a solvent. The adhesive agent is notable for its ability to harden at relatively low temperatures, around 150 degrees Celsius, within a short period of 30 minutes. This process does not cause warp or distortion to the insulation substrate, and it maintains high insulation resistance after hardening. This makes the adhesive agent particularly suitable for use in printed circuit boards. Chida's innovation is encapsulated in his 1 patent.
Career Highlights
Toshiyuki Chida is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to focus on developing advanced materials that meet the demands of modern electronics. His contributions have been instrumental in enhancing the performance of electronic devices.
Collaborations
Chida has collaborated with notable colleagues, including Mineo Kawamoto and Haruo Akahoshi. These collaborations have fostered an environment of innovation and have led to advancements in adhesive technologies.
Conclusion
Toshiyuki Chida's work in adhesive technology exemplifies the impact of innovative thinking in the electronics industry. His patented adhesive agent represents a significant advancement in the field, showcasing his dedication to improving the reliability and performance of electronic components.