The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 1994
Filed:
Jan. 05, 1993
Mineo Kawamoto, Hitachi, JP;
Haruo Akahoshi, Hitachi, JP;
Akio Takahashi, Hitachioota, JP;
Akio Mukoh, Mito, JP;
Kazuo Tanje, Katsuta, JP;
Toyofusa Yoshimura, Naka, JP;
Tokihito Suwa, Katsuta, JP;
Iwao Kaminaga, Hitachi, JP;
Toshiyuki Chida, Naka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent. The adhesive agent is hardened at relatively low temperature (about 150.degree. C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high. The adhesive agent is preferable as an adhesive agent for a printed circuit board.