Company Filing History:
Years Active: 2018-2022
Title: Toshitaka Hayashi: Innovator in Multilayer Wiring Technology
Introduction
Toshitaka Hayashi is a prominent inventor based in Nagaokakyo, Japan. He has made significant contributions to the field of electronic devices, particularly in the development of multilayer wiring boards. With a total of 2 patents to his name, Hayashi's work has had a notable impact on the electronics industry.
Latest Patents
Hayashi's latest patents include innovations in multilayer wiring boards and electronic component modules. The first patent describes a multilayer wiring board that consists of a first insulating layer and a second insulating layer stacked on top of each other. This design incorporates via conductors within each insulating layer and a conductive bonding layer that connects the via conductors. The unique relationship between the bonding layer and the via conductor enhances the board's performance.
The second patent focuses on an electronic component module that utilizes a copper particle paste. This technology ensures that even the inner parts of the joint material are sintered effectively. The copper particles used in this module are known for their excellent oxidation resistance, providing high joint reliability.
Career Highlights
Toshitaka Hayashi is currently employed at Murata Manufacturing Co., Ltd., a leading company in the electronics sector. His work at Murata has allowed him to push the boundaries of technology in multilayer wiring and electronic components.
Collaborations
Hayashi has collaborated with notable coworkers, including Shinya Kiyono and Sho Fujita. Their combined expertise has contributed to the successful development of innovative technologies in their field.
Conclusion
Toshitaka Hayashi is a key figure in the advancement of multilayer wiring technology and electronic components. His patents reflect his commitment to innovation and excellence in the electronics industry.