The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Aug. 01, 2016
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/18 (2006.01); H01B 1/22 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); B22F 1/00 (2006.01); B22F 7/06 (2006.01); H05K 1/09 (2006.01); H01L 23/31 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B22F 1/0059 (2013.01); B22F 7/064 (2013.01); H01B 1/22 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H05K 1/097 (2013.01); H05K 3/32 (2013.01); B23K 35/025 (2013.01); B23K 35/302 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13194 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13487 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29487 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81359 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/12044 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/1131 (2013.01);
Abstract
An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.