Ibaraki, Japan

Toshio Shintani


 

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 85(Granted Patents)


Location History:

  • Osaka, JP (2004 - 2005)
  • Ibaraki, JP (2010 - 2013)

Company Filing History:


Years Active: 2004-2013

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5 patents (USPTO):Explore Patents

Title: **Toshio Shintani: Pioneer in Semiconductor Adhesive Innovations**

Introduction

Toshio Shintani, an innovative inventor based in Ibaraki, Japan, has made significant contributions to the field of semiconductor processing. With a portfolio of five patents, Shintani's work focuses primarily on pressure-sensitive adhesive technologies that enhance semiconductor manufacturing processes.

Latest Patents

Shintani's latest patents include groundbreaking inventions such as the "Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer." This invention features a unique adhesive layer composed of a UV-curable pressure-sensitive adhesive primarily made from an acrylic monomer polymerizable compound. The adhesive layer is designed to provide a stronger adhesive bond to the front surface of a semiconductor wafer compared to its opposite side, ensuring optimal protection during the grinding process.

Additionally, he has developed a "method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet," which leverages the protective capabilities of his adhesive technology. Another notable patent is the "method for producing pressure-sensitive adhesive sheet," enhancing the efficiency and effectiveness of semiconductor substrate processing.

Career Highlights

Toshio Shintani is affiliated with Nitto Denko Corporation, a leader in adhesive technologies. His work at the corporation reflects a strong commitment to advancing semiconductor processing techniques through innovative adhesive solutions. Over the years, he has developed patent-protected technologies that have the potential to improve production practices and enhance the durability of semiconductor wafers.

Collaborations

Throughout his career, Shintani has collaborated with notable colleagues, including Fumiteru Asai and Makoto Komatsubara. Together, they have combined their expertise to push the boundaries of adhesive technologies in semiconductor fabrication, fostering a collaborative environment that encourages innovation.

Conclusion

Toshio Shintani stands as a prominent figure in the realm of semiconductor adhesives, with a focus on practical applications that enhance manufacturing efficiency. His contributions through various patents, combined with valuable collaborations at Nitto Denko Corporation, highlight his significant role in advancing the field of semiconductor technology. As innovations continue to evolve, Shintani's work demonstrates the importance of creative solutions in addressing contemporary challenges in the industry.

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