The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Mar. 10, 2010
Takashi Habu, Ibaraki, JP;
Fumiteru Asai, Ibaraki, JP;
Tomokazu Takahashi, Ibaraki, JP;
Akinori Nishio, Ibaraki, JP;
Toshio Shintani, Ibaraki, JP;
Takashi Habu, Ibaraki, JP;
Fumiteru Asai, Ibaraki, JP;
Tomokazu Takahashi, Ibaraki, JP;
Akinori Nishio, Ibaraki, JP;
Toshio Shintani, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.