This inventor holds 4 USPTO granted patents. Top assignees: Nippon Electric Co., Ltd., Nec Corporation. Active years: 1980-1992.
Company Filing History:
Years Active: 1980-1992
Title: Toshio Ohkubo: Innovator in Semiconductor and Printing Technologies
Introduction
Toshio Ohkubo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of semiconductor devices and thermal printing technologies. With a total of 4 patents to his name, Ohkubo's work has had a lasting impact on these industries.
Latest Patents
Ohkubo's latest patents include a "Process and apparatus for forming bumps on film carrier." This invention involves a film carrier used for fabricating semiconductor devices, which comprises an insulating film and multiple conductive leads. Each lead features a bump with a dome-shaped configuration, enhancing its ability to deform during the thermocompression bonding stage. Another notable patent is the "Integrated thermal printing head and method of manufacturing the same." This thermal printing head utilizes a heating resistor created through thin-film techniques, combined with a wiring circuit developed via thick-film techniques. This innovative design achieves high printing quality at a low cost.
Career Highlights
Throughout his career, Toshio Ohkubo has worked with notable companies such as Nippon Electric Co., Ltd. and NEC Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in his field.
Collaborations
Ohkubo has collaborated with esteemed colleagues, including Yuji Kajiwara and Hidehiko Katoh. These partnerships have fostered innovation and have been instrumental in the development of his patents.
Conclusion
Toshio Ohkubo's contributions to semiconductor and printing technologies exemplify his innovative spirit and dedication to advancing these fields. His patents reflect a commitment to quality and efficiency, making him a noteworthy figure in the world of invention.