This inventor holds 2 USPTO granted patents. Top assignee: Ishida Co. Limited. Active years: 2003-2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kurita-gun, JP (2003)
- Ritto, JP (2004)
Company Filing History:
Years Active: 2003-2004
Title: Toshio Oguri: Innovator in Packaging Technology
Introduction
Toshio Oguri is a notable inventor based in Ritto, Japan. He has made significant contributions to the field of packaging technology, holding a total of 2 patents. His work focuses on improving the efficiency and aesthetics of packaging processes.
Latest Patents
One of Toshio Oguri's latest patents is a device and method for top seal packaging. This invention provides a wrapping device for welding a stretch film to a tray. It is designed to ensure a good appearance after wrapping while minimizing disadvantages during transportation. The device covers the top opening of a tray with a stretch film, welds the film to the tray, and thermally cuts it. The wrapping device includes a stretch mechanism, a control portion, and a film winding portion. The stretch mechanism stretches the film, while the control portion manages the stretching process before welding. The film winding portion is responsible for winding up the stretch film after thermal cutting.
Career Highlights
Toshio Oguri is currently employed at Ishida Co. Limited, where he continues to innovate in packaging technology. His work has been instrumental in advancing the efficiency and effectiveness of packaging solutions.
Collaborations
Toshio has collaborated with notable coworkers, including Norio Kawanishi and Minoru Ohshita. Their combined expertise has contributed to the development of innovative packaging solutions.
Conclusion
Toshio Oguri's contributions to packaging technology through his patents and work at Ishida Co. Limited highlight his role as a significant innovator in the field. His inventions continue to influence the industry and improve packaging processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
