Company Filing History:
Years Active: 1987
Title: Toshio Kuroda: Innovator in Semiconductor Packaging
Introduction
Toshio Kuroda is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of semiconductor devices.
Latest Patents
Kuroda holds a patent for a package comprising a composite metal body brought into contact with a ceramic member to accommodate a semiconductor device. This composite metal body consists of copper and either tungsten or molybdenum. The unique aspect of this invention is the method of creating the composite metal body by impregnating molten copper into a porous block of tungsten or molybdenum. This design allows for control over the thermal expansion coefficient and thermal conductivity by adjusting the amount of copper used. The composite metal block serves as a support for the semiconductor device and can also function as a heat sink to dissipate heat generated by the device. The composition of the metal body typically includes 1-30% copper and 99-70% tungsten or molybdenum by weight.
Career Highlights
Kuroda is currently employed at Narumi China Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.
Collaborations
Kuroda collaborates with Koichi Kumazawa, contributing to the development of cutting-edge technologies in their field.
Conclusion
Toshio Kuroda's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to impact the industry positively.