Narumi China Corporation

Toshio Kuroda

Koichi Kumazawa

In a package comprising a ceramic member so as to accommodate a semiconductor device, a composite metal body which comprises copper and either one of tungsten and molybdenum is brought into contact with the ceramic member. The composite metal body is provided by impregnating molten copper into a porous block of tungsten or molybdenum and changeable in a thermal expansion coefficient and a thermal conductivity by controlling an amount of copper. The composite metal block may be used as a support for supporting the semiconductor device and/or as a heat sink for dissipating heat radiated from the semiconductor device. Preferably, the composite metal body comprises, by weight, 1-30% of copper and 99-70% of tungsten or molybdenum.

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Nagoya, Japan

Toshio Kuroda