Niihama, Japan

Toshinobu Takabatake

This inventor holds 1 USPTO granted patent. Top assignee: Sumitomo Metal Mining Company, Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshinobu Takabatake. Retrieved from https://idiyas.com/inventor/toshinobu-takabatake

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Toshinobu Takabatake: Innovator in Flexible Substrate Manufacturing

Introduction

Toshinobu Takabatake is a notable inventor based in Niihama, Japan. He has made significant contributions to the field of flexible substrate manufacturing. His innovative methods have paved the way for advancements in electronic components.

Latest Patents

Toshinobu Takabatake holds a patent for a "Method of manufacturing a 2-layered flexible substrate." This method involves forming an underlying metal layer on an insulation film using a dry plating technique. The process includes the application of a copper deposition layer and a series of treatments to create a copper conductor layer with a thickness ranging from 1 to 35 micrometers on the insulation film.

Career Highlights

He is currently associated with Sumitomo Metal Mining Company, Ltd., where he continues to develop innovative solutions in materials science. His work has been instrumental in enhancing the efficiency and performance of flexible substrates used in various electronic applications.

Collaborations

Toshinobu has collaborated with esteemed colleagues such as Yukihiro Tamiya and Takehiko Sakurada. Their combined expertise has contributed to the success of various projects within their field.

Conclusion

Toshinobu Takabatake's contributions to the manufacturing of flexible substrates highlight his role as a key innovator in the industry. His patent and collaborative efforts reflect a commitment to advancing technology in electronic materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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