Toshinobu Fujimura

Title: Toshinobu Fujimura: Innovator in Heat Dissipation Technology

Introduction

Toshinobu Fujimura is an inventor based in Tsukuba-shi, Japan. He has made significant contributions to the field of heat dissipation technology. His innovative approach focuses on the development of advanced materials and methods for effective heat management in electronic devices.

Latest Patent Applications

Fujimura's notable patent application includes a heat dissipation substrate, heat dissipation circuit board, heat dissipation member, and method for manufacturing heat dissipation substrate. This application describes a heat dissipation substrate that features a metal member adjacent to one surface of an insulating layer. The metal member is composed of materials such as copper, copper alloys, aluminum, or aluminum alloys, and is designed in a sheet shape with a thickness ranging from 0.2 to 20 mm. The insulating layer consists of a first and a second insulating layer, both of which are metal oxide layers made from different aluminum oxides. The first insulating layer has a thickness of 0.01 to 0.2 μm and a porosity of 10% or less, while the second insulating layer has a thickness of 0.3 to 30 μm and a porosity of 10% or less.

Conclusion

Toshinobu Fujimura's work in heat dissipation technology showcases his innovative spirit and dedication to improving electronic device performance. His contributions are poised to make a significant impact in the field of thermal management.