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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12177972 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Aug. 23, 2022

Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board

Applicant:

Nof Corporation, Tokyo, JP;

Inventors:

Toshinobu Fujimura, Tsukuba, JP;

Katsumi Nakasato, Tsukuba, JP;

Muneaki Iizuka, Tsukuba, JP;

Assignee:

NOF CORPORATION, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 3/00 (2006.01); C23C 16/40 (2006.01); C23C 16/448 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); C23C 16/403 (2013.01); C23C 16/4486 (2013.01); H01L 21/4846 (2013.01); H01L 23/3735 (2013.01); H05K 1/0209 (2013.01); H05K 3/44 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/0191 (2013.01); H05K 2203/088 (2013.01);
Abstract

According to the present invention, a heat-dissipating circuit board is formed by providing a metal material adjacent to one surface of an insulating layer and providing a conductive metal layer to the other surface of the insulating layer. The metal material is a sheet of copper or a copper alloy or aluminum or an aluminum alloy and is 0.2-20 mm thick. The insulating layer is a metal oxide layer that has the composition AlxOyTz, is 0.2-30 μm thick, has a volume resistivity of at least 1000 GΩ·cm, and has a porosity of no more than 10%. The heat-dissipating circuit board has excellent heat-dissipation properties and insulation properties.

Find Patent Forward Citations

Fujimura, Toshinobu. (2024). Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board (U.S. Patent No. 12177972). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12177972

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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