Tokyo, Japan

Toshihiro Oyoshi



Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2014-2017

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2 patents (USPTO):Explore Patents

Title: **Toshihiro Oyoshi: Innovating Surface Roughening Techniques for Copper Plates**

Introduction

Toshihiro Oyoshi, an accomplished inventor based in Tokyo, Japan, has made significant contributions to the field of electroplating technology. With two patents to his name, Oyoshi has focused his efforts on enhancing the production methods of surface roughened copper plates, addressing common challenges in the electroplating process.

Latest Patents

Oyoshi's latest patents revolve around a production method and device for creating surface roughened copper plates. The main problems addressed by these inventions include the need for roughening both sides of a copper plate while forming protrusions with fine bump shapes and minimizing the deterioration of electroplating solutions used for copper plating. The innovative process involves arranging electrodes in an electroplating copper solution, with a copper plate positioned between them. An anodic treatment is first performed to generate copper fine particles on both surfaces, followed by a cathodic treatment to fix these particles onto the copper plate. This cycle can be repeated, allowing for improved results in the roughening process.

Career Highlights

Toshihiro Oyoshi is employed by The Furukawa Electric Co., Ltd., where he applies his expertise in materials engineering and electroplating technology. His work has not only contributed to his company's advancements but also plays an essential role in improving manufacturing efficiencies within the industry.

Collaborations

Throughout his career, Oyoshi has collaborated with other skilled professionals, including Hajime Watanabe and Sadao Ishihama. Their collective expertise has fostered an environment of innovation, driving advancements in electroplating techniques and technologies.

Conclusion

Toshihiro Oyoshi's innovative approach to electroplating and surface treatment of copper plates positions him as a key figure in the field. His patents not only provide solutions to existing problems but also pave the way for future developments in manufacturing processes. With a strong foundation in collaboration and expertise, Oyoshi continues to make an impact in the electroplating technology landscape.

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