The Furukawa Electric Co., Ltd.

Toshihiro Oyoshi

Takahiro Imai

Hajime Watanabe

Kiyoteru Yamamoto

Sadao Ishihama

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes () as a similar pole for therebetween to be opposed to each other in an electroplating copper solution, and then to be arranged a copper plateat therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate, by performing an electrolytic process with the copper plateas a positive electrode and the electrodesas negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plateas a negative electrode and the electrodesas positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

Production method and device of surface roughened copper plate, and surface roughened copper plate

A process is provided for roughening both sides of a copper plate by forming protrusions with fine bump shapes on both sides of the copper plate in an electroplating solution for plating copper while reducing deterioration of the electroplating solution. Opposed pairs of negative electrodes () and positive electrodes () are provided in an electroplating copper solution (), and a copper plate () is arranged between the pair of negative electrodes (). An anodic treatment for generating copper fine particles on both surfaces of the copper plate () is carried out by performing an electrolytic process for three to ten minutes with the copper plate () as a positive electrode between the negative electrodes (). Then a cathodic treatment is carried out by moving the copper plate () between positive electrodes () and performing an electroplating of copper for three to ten minutes with the copper plate () as a negative electrode for fixing the copper fine particles onto the surfaces of the copper plate (). The cycle of anodic and cathodic treatment may be performed more than one time.

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Tokyo, Japan

Toshihiro Oyoshi