Toshihiro Furusawa

Title: The Innovations of Toshihiro Furusawa

Introduction

Toshihiro Furusawa is a notable inventor based in Gifu, Japan. He has made significant contributions to the field of technology, particularly in the areas of chip packaging and camera modules. With a total of 10 patents to his name, Furusawa's work has had a considerable impact on modern electronics.

Latest Patents

Furusawa's latest patents include a Chip Size Package (CSP) that integrates an antenna for wireless communication. This innovative design facilitates signal transmission and reception with external substrates, utilizing a rewiring layer positioned between a silicon layer and solder bumps. Another significant invention is a camera module and camera apparatus featuring a parallel link mechanism for reciprocating an image pickup device. This camera module comprises a lens, an image pickup device aligned with the optical axis of the lens, and an actuator section that allows the image pickup device to move in the optical axis direction. The actuator section includes a movable joint section, a parallel link mechanism, and a movable element that performs displacement motion based on the applied voltage.

Career Highlights

Throughout his career, Toshihiro Furusawa has worked with prominent companies such as Sanyo Electric Co., Ltd. and Sony Corporation. His experience in these leading organizations has contributed to his expertise and innovative capabilities in the field of technology.

Collaborations

Furusawa has collaborated with notable coworkers, including Yoshihito Higashitsutsumi and Nobuhiro Mitani. These partnerships have likely fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Toshihiro Furusawa's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the industry. His innovative designs continue to influence advancements in electronics and communication.