Kobe, Japan

Toshihiko Ryo


Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Toshihiko Ryo

Introduction

Toshihiko Ryo is a notable inventor based in Kobe, Japan. He has made significant contributions to the field of plating technology. His innovative approach has led to the development of a unique plating apparatus that enhances the efficiency of plating processes.

Latest Patents

Toshihiko Ryo holds a patent for a "Plating apparatus, plating method, and method for producing wire rod having the surface plated." This patent describes a plating apparatus that includes a plating tank, cathodes, a holding mechanism, at least one anode, and a rotation mechanism. The plating tank contains an annularly or helically wound substrate along with a plating solution. The cathodes are strategically placed inside the plating tank, while the holding mechanism secures the cathodes at positions electrically connected to the outer periphery of the substrate. The anode is positioned on the inner periphery side of the substrate held by the holding mechanism. The rotation mechanism allows for the rotation of either the substrate and cathodes or the anode around the axis of the wound substrate.

Career Highlights

Throughout his career, Toshihiko Ryo has worked with prominent organizations, including Teikoku Ion Co., Ltd and the National Institutes for Quantum Science and Technology. His work in these institutions has allowed him to refine his expertise in plating technologies and contribute to advancements in the field.

Collaborations

Toshihiko Ryo has collaborated with notable colleagues such as Takashi Nakamura and Takuya Kawawaki. These collaborations have fostered innovation and have been instrumental in the development of new technologies in plating.

Conclusion

Toshihiko Ryo's contributions to plating technology through his innovative patent and collaborations highlight his importance in the field. His work continues to influence advancements in plating methods and apparatuses.

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