The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Aug. 06, 2021
Teikoku Ion Co., Ltd, Higashiosaka, JP;
National Institutes for Quantum Science and Technology, Chiba, JP;
Okazaki Manufacturing Company, Kobe, JP;
Takashi Nakamura, Higashiosaka, JP;
Takuya Kawawaki, Higashiosaka, JP;
Mitsuhiko Terashita, Nishimuro-gun, JP;
Masahiko Hirakami, Higashiosaka, JP;
Masafumi Hojo, Higashiosaka, JP;
Ryosuke Nakamura, Higashiosaka, JP;
Masao Ishikawa, Chiba, JP;
Taketo Nishikawa, Kobe, JP;
Toshihiko Ryo, Kobe, JP;
TEIKOKU ION CO., LTD, Higashiosaka, JP;
NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY, Chiba, JP;
OKAZAKI MANUFACTURING COMPANY, Kobe, JP;
Abstract
A plating apparatus () is disclosed including a plating tank (), cathodes (to), a holding mechanism (), at least one anode (), and a rotation mechanism (). The plating tank () contains an annularly or helically wound substrate () together with a plating solution. The cathodes (to) are placed inside the plating tank (). The holding mechanism () holds the cathodes (to) at positions electrically connected to the outer periphery of the substrate () and holds the substrate () via the cathodes (to). The anode () is placed at least on the inner periphery side of the substrate () held by the holding mechanism (). The rotation mechanism () rotates at least either the substrate () and cathodes (to) held by the holding mechanism () or the anode (), or both, around the axis of the wound substrate ().