Company Filing History:
Years Active: 2003
Title: Innovations by Toshiharu Egami
Introduction
Toshiharu Egami is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
One of Toshiharu Egami's key patents is titled "Interconnection structure with film to increase adhesion of the bump." This patent describes a semiconductor device that features a highly resistant metal film and a method for producing such a device. The invention includes a metal film formed on an electrode pad, along with a protection film in areas where the metal film is absent. Notably, the metal film has a greater thickness at its peripheral end portion, which is in contact with the protection film. The production method involves activating the surface of the electrode pad using a chelating solution containing glycine and a metallic element, followed by forming the metal film through electroless metal plating.
Career Highlights
Toshiharu Egami is associated with Fujitsu Corporation, a leading company in technology and innovation. His work at Fujitsu has allowed him to contribute to advancements in semiconductor devices, which are crucial for modern electronics.
Collaborations
Throughout his career, Toshiharu has collaborated with esteemed colleagues, including Yutaka Makino and Eiji Watanabe. These collaborations have further enriched his contributions to the field.
Conclusion
Toshiharu Egami's innovative work in semiconductor technology exemplifies the importance of advancements in this field. His patent on interconnection structures significantly enhances the performance of semiconductor devices. His contributions continue to influence the industry positively.