Kudamatsu, Japan

Toshiaki Ayabe

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Plant Mechanics Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiaki Ayabe. Retrieved from https://idiyas.com/inventor/toshiaki-ayabe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Toshiaki Ayabe: Innovator in Film Peeling Technology

Introduction

Toshiaki Ayabe is a notable inventor based in Kudamatsu, Japan. He has made significant contributions to the field of film peeling technology, particularly through his innovative patent that addresses common issues in the manufacturing process.

Latest Patents

Ayabe holds a patent for a film peeling device designed to prevent deformation or defects in substrates during the film conveying process. This device ensures that films adhered to substrate leading ends are peeled off without damaging the substrate or deteriorating its quality. The invention includes a substrate holding mechanism, an adhering and peeling mechanism, a film holding tool, a film conveying unit drive mechanism, and a recovery container for the films being gripped and conveyed.

Career Highlights

Toshiaki Ayabe has dedicated his career to advancing technology in the manufacturing sector. His work at Hitachi Plant Mechanics Co., Ltd. has allowed him to focus on developing solutions that enhance production efficiency and product quality.

Collaborations

Ayabe has collaborated with notable colleagues such as Kazuo Takahashi and Shigenori Takesue. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Toshiaki Ayabe's contributions to film peeling technology exemplify his commitment to innovation and quality in manufacturing processes. His patent reflects a deep understanding of the challenges faced in the industry and offers practical solutions to enhance production efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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