Beijing, China

Tongzhi Yang

This inventor holds 1 USPTO granted patent. Top assignee: Beihang University. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tongzhi Yang. Retrieved from https://idiyas.com/inventor/tongzhi-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Tongzhi Yang in Heat Dissipation Technology

Introduction

Tongzhi Yang is a prominent inventor based in Beijing, China. He has made significant contributions to the field of heat dissipation technology, particularly in high power density cabinets. His innovative approach addresses the challenges associated with efficient heat management in electronic systems.

Latest Patents

Tongzhi Yang holds a patent for an "Overall efficient heat dissipation system for high power density cabinet." This system comprises a pump-driven two-phase circulation loop high-power-chip direct heat dissipation system and a cabinet air-cooling system. The cabinet air-cooling system includes a refrigerant circulation loop and a cabinet internal air circulation loop. The pump-driven two-phase circulation loop is designed to perform fixed-point heat dissipation for main heating elements, such as CPUs and GPUs, in a server. Meanwhile, the cabinet air-cooling system manages air-cooling heat dissipation for other heating elements in the server. This innovative design enhances the overall efficiency of heat management in high-performance computing environments.

Career Highlights

Tongzhi Yang is affiliated with Beihang University, where he continues to advance research in thermal management technologies. His work has garnered attention for its practical applications in modern computing systems. With a focus on high power density environments, Yang's contributions are vital for the development of more efficient electronic devices.

Collaborations

Tongzhi Yang has collaborated with notable colleagues, including Weixing Yuan and Bo Yang. Their combined expertise has fostered advancements in heat dissipation technologies, further enhancing the impact of their research.

Conclusion

Tongzhi Yang's innovative work in heat dissipation technology represents a significant advancement in managing thermal challenges in high power density cabinets. His contributions are essential for the future of efficient electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…