Shanghai, China

Tongxin Wang

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Qualcomm Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tongxin Wang. Retrieved from https://idiyas.com/inventor/tongxin-wang-vlq6aqpc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Tongxin Wang in Wireless Communications

Introduction

Tongxin Wang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of wireless communications. His innovative work has led to the development of a patent that addresses critical aspects of protocol stack sharing in dual connectivity.

Latest Patents

Tongxin Wang holds a patent titled "Method for protocol stack sharing in dual connectivity." This patent describes methods, systems, and devices for wireless communications. The invention allows user equipment (UE) to be configured with two subscriptions. The first subscription supports dual connectivity with one or more cell groups, such as a master cell group (MCG) and a secondary cell group (SCG). The second subscription may not support dual connectivity. Each subscription can support communications with various radio access technologies (RAT). The UE can utilize the protocol stack for a RAT in the first subscription to receive idle-mode signaling, such as paging messages, from the second subscription using the same RAT. This innovation enhances the efficiency and flexibility of wireless communication systems.

Career Highlights

Tongxin Wang is currently employed at Qualcomm Incorporated, a leading company in the field of wireless technology. His work at Qualcomm has allowed him to contribute to cutting-edge advancements in communication technologies. With a focus on improving connectivity and user experience, Wang's innovations are paving the way for future developments in the industry.

Collaborations

Tongxin Wang has collaborated with notable colleagues, including Ling Xie and Bhupesh Manoharlal Umatt. These collaborations have fostered an environment of innovation and creativity, leading to significant advancements in their respective fields.

Conclusion

Tongxin Wang's contributions to wireless communications through his patent and work at Qualcomm Incorporated highlight his role as an influential inventor. His innovative methods for protocol stack sharing in dual connectivity are set to impact the future of wireless technology significantly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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