Company Filing History:
Years Active: 2013-2024
Title: Innovations by Inventor Tong-suk Kim in Semiconductor Technology
Introduction
Tong-suk Kim, based in Hwaseong-si, South Korea, is an accomplished inventor renowned for his contributions to semiconductor technology. With a notable portfolio of six patents, he has significantly advanced the field, particularly in the area of package-on-package (PoP) semiconductor packaging.
Latest Patents
Among his latest innovations is the package-on-package (PoP) semiconductor package, designed to enhance electronic systems. This innovative package comprises an upper package and a lower package, which houses a first semiconductor device in a designated area and a second semiconductor device in another. Additionally, it features a command-and-address vertical interconnection, a data input-output vertical interconnection, and a memory management vertical interconnection, all positioned adjacent to the first area. This configuration optimizes performance and efficiency in electronic systems.
Career Highlights
Tong-suk Kim is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise to push the boundaries of semiconductor design. His innovative mindset and technical proficiency have positioned him as a valuable asset within the company, leading to the successful filing and granting of multiple patents.
Collaborations
Throughout his career, Tong-suk Kim has collaborated with esteemed colleagues such as Byeong-yeon Cho and Heung-Kyu Kwon. These collaborations have fostered an environment of innovation, allowing the team to tackle complex challenges in semiconductor technology and drive advancements in their field.
Conclusion
As an inventor, Tong-suk Kim is making significant strides in the semiconductor industry, particularly with his work on package-on-package solutions. His dedication to innovation and collaboration with fellow experts at Samsung Electronics Co., Ltd. underscores his impact in advancing modern electronic systems.