Samsung Electronics Co., Ltd.

Tong-suk Kim

Byeong-yeon Cho

Heung-Kyu Kwon

Hyun-A Kim

Jeong-Oh Ha

A package-on-package (PoP) semiconductor package includes an upper package and a lower package. The lower package includes a first semiconductor device in a first area, a second semiconductor device in a second area, and a command-and-address vertical interconnection, a data input-output vertical interconnection, and a memory management vertical interconnection adjacent to the first area.

Package-on-package (PoP) semiconductor package and electronic system including the same

A semiconductor device having a printed circuit board and a semiconductor chip. The printed circuit board includes a chip region, a plurality of first ball lands adjacent to the chip region, and at least one second ball land adjacent to the first ball lands. The semiconductor chip is mounted on the chip region. The first ball lands are arranged to have a first pitch. One of the first ball lands which is nearest to the second ball land, and the second ball land have a second pitch greater than the first pitch.

Growing community of inventors

Hwaseong-si, South Korea

Tong-suk Kim