Company Filing History:
Years Active: 2006
Title: The Innovations of Inventor Tong Liao
Introduction
Tong Liao, an inventive mind based in Hsinchu, Taiwan, has made significant contributions to the field of advanced materials and semiconductor manufacturing. With a strong background in engineering, Liao's work embodies creativity and technical prowess, reflected in his innovative patent.
Latest Patents
Liao holds a patent for a unique invention titled "Pad backer and CMP process using the same." This patent describes a pad backer consisting of a backing plate, an elastomer layer, and a pad backing ring. The elastomer layer features a bottom surface that is bonded to the backing plate and an upper surface with a protruding part at the edge. The pad backing ring complements this design with a recessed part on its inner bottom surface that matches the protruding part of the elastomer layer, ensuring a secure engagement. This innovation is pivotal in enhancing the efficiency of chemical mechanical planarization (CMP) processes widely used in semiconductor manufacturing.
Career Highlights
Tong Liao is currently employed at United Microelectronics Corporation, a renowned leader in the semiconductor industry. His expertise has played a crucial role in the development and enhancement of materials used in microelectronic applications. The patent he has developed demonstrates his dedication to pushing the boundaries of technology and improving manufacturing processes.
Collaborations
Throughout his career, Liao has collaborated closely with colleagues such as Li-Min Chang and Chen-Wen Pao. These partnerships have fostered an environment of innovation and creativity, allowing them to tackle complex challenges in the field together. Their collective efforts contribute significantly to advancing technologies in the semiconductor sector.
Conclusion
Tong Liao’s contributions to the field of innovation in materials engineering reflect his commitment to excellence and advancement. His patent not only showcases his inventive capabilities but also reinforces the ongoing evolution of semiconductor manufacturing processes. As part of United Microelectronics Corporation, Liao continues to be a pivotal player in driving innovation and shaping the future of technology.