This inventor holds 1 USPTO granted patent. Top assignee: The State University of New York. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Innovations of Tong Jing in Reconfigurable 3D Interconnect Technology
Introduction
Tong Jing is an accomplished inventor based in Guilderland Center, NY (US). He has made significant contributions to the field of integrated circuit technology, particularly in the area of reconfigurable 3D interconnects. His innovative work has the potential to enhance the performance and efficiency of digital and RF signal transmission.
Latest Patents
Tong Jing holds a patent for a "Reconfigurable RF/digital hybrid 3D interconnect." This invention provides a versatile solution for digital and RF signals by utilizing an array of vertical interconnect vias (TSVs). The design allows for a signal path between core elements of a 3D integrated circuit (IC), enabling real-time adjustments and capacity optimization during operation.
Career Highlights
Tong Jing is affiliated with the State University of New York, where he continues to advance his research and development efforts. His work focuses on improving the efficiency and functionality of 3D ICs, which are crucial for modern electronic devices.
Collaborations
Some of his notable coworkers include Robert E Geer and Wei Wang, who contribute to the collaborative environment that fosters innovation and research excellence.
Conclusion
Tong Jing's contributions to the field of reconfigurable 3D interconnect technology exemplify the impact of innovative thinking in electronics. His patent and ongoing research are paving the way for advancements in integrated circuit design and functionality.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile