Tong-An Lee

Title: Innovations by Tong-An Lee

Introduction

Tong-An Lee is a notable inventor based in Pantao, Taiwan. He has made significant contributions to the field of photolithography, particularly in the area of wafer bonding processes. His innovative methods have the potential to enhance the precision and efficiency of semiconductor manufacturing.

Latest Patents

Tong-An Lee holds a patent for a method of maintaining photolithographic precision alignment after the wafer bonding process. This method involves creating two cavities at the rear surface of a top wafer, corresponding to alignment marks on a bottom wafer. The depth of these cavities is designed to be deeper than that of the final membrane structure. After bonding the top wafer to the bottom wafer, which already contains alignment marks and a microstructure, the bonded wafer undergoes annealing to strengthen the bond. A thinning process is then applied to reduce the thickness of the top wafer, allowing the alignment marks to emerge in the cavities, thus serving as alignment marks for exposure equipment.

Career Highlights

Tong-An Lee is associated with Asia Pacific Microsystems, Inc., where he continues to work on advancing technologies in the semiconductor industry. His expertise in photolithography and wafer bonding has positioned him as a valuable asset in his field.

Collaborations

He has collaborated with notable colleagues, including Chung-Yang Tseng and Shih-Chin Gong, contributing to various projects that aim to push the boundaries of semiconductor technology.

Conclusion

Tong-An Lee's innovative approach to maintaining photolithographic precision alignment showcases his commitment to advancing semiconductor manufacturing processes. His contributions are vital for the ongoing evolution of technology in this field.