This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ibiden Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Tomoyuki Ikeda: Wiring Substrate Manufacturing Innovation
Introduction
Tomoyuki Ikeda is an inventor associated with Ibiden Corporation in Ogaki, Japan. His patent work focuses on a method for manufacturing wiring substrates.
Latest Patents
Ikeda is credited with 1 patent, titled “Method for Manufacturing Wiring Substrate.” The method forms a resin insulating layer over a first conductor layer, roughens the resin surface, and then creates an opening that exposes part of the first conductor layer. A second conductor layer is formed on the resin surface, with a via conductor in the opening to connect the conductor layers.
Career Highlights
Ikeda’s listed invention addresses key steps in wiring substrate fabrication, including surface treatment, opening formation, and via conductor creation. The patent is associated with Ibiden Corporation.
Collaborations
His listed coworkers include Keisuke Shimizu and Hiroyuki Watanabe.
Conclusion
Tomoyuki Ikeda’s patent describes a manufacturing approach for forming wiring substrates with a via connection between conductor layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile