Nagoya, Japan

Tomoyasu Sumiya

This inventor holds 1 USPTO granted patent. Top assignee: Ngk Insulators, Inc.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomoyasu Sumiya. Retrieved from https://idiyas.com/inventor/tomoyasu-sumiya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Tomoyasu Sumiya and Thin-Section Casting Innovation.

Introduction

Tomoyasu Sumiya is an inventor associated with Nagoya, Japan, and Ngk Insulators, Inc. His patent work includes a method designed to produce cast bodies with thin portions while preventing the thin material from melting during metal-ceramic insertion.

Latest Patents

Sumiya is credited with 1 patent: “Method for Producing Casted Body Having Thin Portion.” The invention describes inserting a thin member made from an iron, copper, or nickel alloy into an iron or copper matrix. A ceramic layer on the member’s surface helps prevent it from melting during insertion. The method also describes forming the ceramic layer using a thin member containing at least 0.5 wt% in total of one or more of aluminum, titanium, beryllium, and magnesium. The layer may form during insertion or during heating beforehand.

Career Highlights

Sumiya’s documented patent contribution focuses on controlling heat and material behavior in casting. The method addresses the challenge of incorporating a thin portion into a cast body without losing its intended structure.

Collaborations

Sumiya is associated with Ngk Insulators, Inc. His listed coworker is Yasuyuki Ishihara.

Conclusion

Tomoyasu Sumiya’s patent describes a ceramic-layer approach to protecting thin alloy members during metal-ceramic insertion, contributing a practical method for producing cast bodies with thin portions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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