Osaka, Japan

Tomoya Nishiki


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Tomoya Nishiki

Introduction

Tomoya Nishiki is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of packaging technology, particularly through his innovative patent related to multilayer bodies. His work focuses on enhancing the functionality and usability of food-packaging materials.

Latest Patents

Nishiki holds a patent for a multilayer body and a package utilizing the same. This invention provides a multilayer body that exhibits favorable thermal dimensional stability. It is designed to produce a food-packaging bag that minimizes resistance at opening by tearing, without the need for perforations or guiding lines through laser half-cutting. The design ensures that only a small extent of parting occurs, making it easier for consumers to access the contents. The multilayer body consists of one or more types of base material films and a polyolefin-based resin sealant film. The sealant film is made from a polyolefin-based resin composition containing a propylene-α-olefin random copolymer, which enhances its performance.

Career Highlights

Tomoya Nishiki is currently employed at Toyobo Co., Ltd., a company known for its advancements in materials and technology. His work at Toyobo has allowed him to focus on innovative solutions in packaging, contributing to the company's reputation for quality and innovation.

Collaborations

Nishiki collaborates with talented coworkers, including Wakato Tomatsu and Tadashi Nishi. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Tomoya Nishiki's contributions to packaging technology through his patent demonstrate his commitment to innovation and improvement in consumer products. His work not only enhances the usability of food-packaging materials but also reflects the ongoing advancements in the field.

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