Tomoya Kitamura

Title: Tomoya Kitamura: Patent Work in Wiring Substrate Technology

Introduction

Tomoya Kitamura is an inventor associated with Shinko Electric Industries, Ltd., in Nagano, Japan. His listed patent focuses on a terminal structure and wiring substrate, addressing the arrangement of conductive and protective layers in an electrical connection. Kitamura is credited with 1 patent in the information provided.

Latest Patents

Kitamura’s listed patent, “Terminal Structure and Wiring Substrate,” describes a structure with a first wiring layer covered by insulation, an opening through the insulation, and via wiring that connects to a second wiring layer. A protective metal layer and solder layer are formed above the second wiring layer, with an intermetallic compound layer between them.

The protective metal layer projects beyond the side of the second wiring layer. The intermetallic compound layer covers only the protective metal layer’s upper surface, while the solder covers only the intermetallic compound layer’s upper surface. This arrangement leaves the side surfaces of the intermetallic compound, protective metal, and second wiring layers exposed.

Career Highlights

The available information associates Kitamura’s patent work with Shinko Electric Industries, Ltd., a company involved in electronic components and packaging technologies. His listed invention concerns the construction of a terminal and wiring substrate, particularly the relationships among its wiring, protective, solder, and intermetallic layers.

Collaborations

Junichi Nakamura and Yoko Nakabayashi are identified as Kitamura’s coworkers. The provided information does not specify their roles in the patent or whether they collaborated on this invention.

Conclusion

Tomoya Kitamura’s listed patent documents a layered terminal structure designed for a wiring substrate, with particular attention to the placement and coverage of protective metal, solder, and intermetallic compound layers.